Electronic Simulation

Ansys offers a full stack of design and analysis software packages, each focused on a key aspect of Electronics Design and Analysis, and all centered around a fresh, contemporary Interface called the Ansys Electronics Desktop.

ANSYS SHERLOCK is an electronics reliability simulation software that uses advanced algorithms to predict the lifespan and failure modes of electronic systems and components. It analyzes physical, thermal, and mechanical stresses to ensure the design meets industry standards and specifications.

ANSYS MAXWELL is the industry leader for electromagnetic field simulation. With automatic meshing, and a multi-domain, multi-physics approach, the complex, dynamic motion of electromechanical devices such as Motors, Actuators, Relays, and solenoids can be fully characterized, and optimized, prior to the first prototype. Maxwell includes a comprehensive set of solvers for AC and DC voltage applications as well as static, transient, and rigid motion analysis. Coupled with MOTOR-CAD, simulation of electric motors is automated: Automatic winding CAD geometry with thermal, structural, and electromagnetic physics.

With the rise of 5G technology, never before has it been more critical to analyze the 3D electromagnetic field around our electronics. ANSYS HFSS is the industry standard for simulating antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters and connectors. Coupled with High-Performance Computing (HPC) and Optimetrics, a fully digital Design of Experiments can be simulated to optimize advanced High Frequency Electromagnetic designs such as a Phased Array Antenna for military applications.

Thermal optimization is a critical step in the electronic simulation process as trends continue towards putting more power in smaller footprints. Understanding the heat transfer due to conduction, convection and radiation is critical at every level, and ANSYS ICEPAK can analyze ECAD/MCAD geometry at any scale – whether it is at component, board, or system level.

ANSYS SIWAVE allows the analysis of Integrated Circuits (IC’s) and Printed Circuit Boards (PCB’s) for Electromagnetic Interference (EMI), allowing the optimization of both power and signal integrity. With multi-scale (Die, Chip, Package, Board) capability, and direct connections to Ansys’s Structural and Thermal capabilities, true electronic reliability can be predicted, and ultimately maximized.

HIGH PERFORMANCE COMPUTING will increase the amount you learn from your simulations, both in breadth and depth. For small, young companies that qualify, the ANSYS STARTUP PROGRAM delivers an unparalleled amount of capability (Multi-Physics, HPC, etc.) through the Discipline-specific Licensing Bundles.

For climbing up the learning curve, Fastway Engineering has bespoke curriculum and in-house instructors to lead timely, impactful, classroom-based training. Of course, we understand it’s tough to get out of the office, so for those who are looking for self-paced courses we offer a plethora of web-based training through the Ansys Learning Hub. Finally, for the highest level of simulation maturity, we work with our clients to create custom knowledge management programs using our Problem-Based Learning approach.

Sometimes the schedule just doesn’t allow for the weeks and months it takes to deploy, train, and build confidence in trusting your Electromagnetic Analysis. Sometimes, production is stopped, or the engineering team is spinning in circles. For those cases our team of Simulation experts can review, scope, and execute analyses in-house in just a matter of days. Since Fastway Engineering started out as a training and services company, we are constantly using these tools in our own projects. As a result, we have been able to reach peak levels of speed and accuracy. From managing Large Multiphysics Multi-Scale models, to wrapping AI and Optimization around a parametric model for a virtual DOE, Fastway Engineering uses Ansys Electronic Simulation tools every day to help clients all over.