Ansys Mechanical Day 3, Thermal Stress

Overview: Download the linked ‘wine glass’ model below then create and assign the glass material using the properties in the linked spreadsheet.

To Start:

• Add a heat flux to the inner surfaces of the wine glass of 7.646e-5 W/mm^2
• Set the bottom surface of the wine glass to 32F
• Run the analysis and ensure a mesh independent solution.

Model: Thermal Stress Analysis Model: Wine glass

Next:

• Utilize the Workbench to create a Thermal Stress Analysis
• Add a constraint to the bottom surface of the glass where t=32
• Run the analysis and review the results

Note: Where is the high stress location located? What does this tell us? Is it realistic?

Discuss: Strategies for modeling thermal expansion.

Printed Circuit Board Assembly (PCBA):

• Pre-Process: Complete the material properties of the PCB board.
• Solve: Use the results from the steady state thermal analysis project to perform a thermal stress analysis.
• Post Process: Observe the overall deformation, and the locations of high stress.

What do the results tell you about designing for thermally stressed environments?