Creo Simulate Day 4, Thermal Stress

Overview: Download the linked ‘wine glass’ model below then create and assign the glass material using the properties in the linked spreadsheet.

To Start:

• Add a surface heat load to the inner surfaces of the wine glass of 8350 in^2 lbm/sec^3
• Set the bottom surface of the wine glass to 32F
• Run the analysis and review the results

Model: Thermal Stress Analysis Model: Wine glass

Next:

• Enter the structure mode of Mechanica (‘edit’ then ‘Mechanica model setup’)
• Apply the steady-state temperature load (‘insert’, ‘temperature load’, then ‘mec/t’)
• Add a constraint to the bottom surface of the glass where t=32
• Run the analysis and review the results

Note: Where is the high stress location located? What does this tell us? Is it realistic?

Discuss: Tricks to modeling for free thermal expansion.

Printed Circuit Board Assembly (PCBA):Pre-Process:

• Update the material properties of the PCB board as shown here.

Solve:

• Use the results from the steady state thermal analysis tutorial to perform a thermal stress analysis.

Post Process:

Observe the overall deformation, and the locations of high stress. What does this tell you about designing for thermally stressed environments?