19 results for author: Jim Shaw
Hot Topic: Computer & Electronics Cooling
With increasing capabilities in smaller packaging, power densities are skyrocketing and as a result electronics cooling is one of, if not the most, popular applications of engineering simulation in the computer industry. From using FEA to overcome Coefficient of Thermal Expansion (CTE) challenges, to using CFD to optimize cooling systems while minimizing cost and complexity, computer simulation is the only way to optimize the layout and packaging of electronics.
In regards to heat transfer (technical term for "cooling"), there are three mains methods: conduction (solid-to-solid), convection (solid-to-fluid), and radiation (surfa...
Ansys Mechanical Training: Intro to FEA
Ansys' Workbench environment is intuitive, and directly connects to native CAD...
Ansys Workbench Training: Nonlinear FEA
Leverage the deep bench of Nonlinear capabilities in Ansys Workbench...
Ansys Mechanical Training: Dynamic FEA
Gain a deeper understanding of the Dynamics of your designs using Ansys Workbench...
PTC Creo Simulate Training: Intro to FEA
Formerly "Pro/Mechanica", this code has a unique high order P-Mesh algorithm...
PTC Creo Simulate Training: Nonlinear FEA
Flex your materials and your analysis skills with Nonlinear FEA in Creo Simulate...
PTC Creo Simulate Training: Dynamic FEA
Analyze your Dynamics in the fully parametric Creo Simulate environment...
PTC Creo MDX/MDO Training: Mechanism Design and Analysis
Learn the power of PTC's Mechanism Design Extension and Dynamics Option...
PTC Creo Parametric Training: Intro to 3D CAD
Formerly called Pro/Engineer, PTC put Para- metric modeling on the map in the 1980's...
The Fastway to the HPC Cloud
Fastway Engineering teams up with UberCloud to bring High Performance Computing to Product Designers
